Optoelectronics Packaging Design Engineer

At Ouster, we build sensors and tools for engineers, roboticists, and researchers, so they can make the world safer and more efficient. We've transformed LIDAR from an analog device with thousands of components to an elegant digital device powered by one chip-scale laser array and one CMOS sensor. The result is a full range of high-resolution LIDAR sensors that deliver superior imaging at a dramatically lower price. Our advanced sensor hardware and vision algorithms are used in autonomous cars, drones and many other applications. If you’re motivated by solving big problems, we’re hiring key roles across the company and need your help!

We are looking for an Optoelectronics Packaging Design Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, manufacturing, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.

RESPONSIBILITIES

• Lead the design, simulation, and development of high-performance IC package designs and chip carriers to meet product and qualification requirements.  Own each IC package end-to-end.
• Work closely with across hardware engineering disciplines to design best-in-class package assemblies for advanced laser and opto-electronic ASIC chips operating in harsh environments.
• Work closely with the manufacturing engineering and quality teams to ensure a seamless transition from prototype to high-volume production.
• Define and execute test plans for package/system level reliability.
• Conduct failure analysis to drive continuous improvement
• Support yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly.
• Manage vendors, including sourcing, vetting, quoting, design for manufacturing (DFM), and low-volume order placement of diverse components such as substrates, epoxies, coated glass, PCBAs, and tooling.

 BASIC QUALIFICATIONS

• 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree. 
• Proficiency in 3D CAD (e.g., SolidWorks) and FEA simulation tools (e.g., ANSYS).
• Hands-on experience with automated high-accuracy die bonding, wirebonding, and active optical alignment systems.
• Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates
• Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test)
• Working knowledge of Failure Analysis tools such as X-ray, 3D interferometry, DIC microscopy, SEM, cross-section, destructive testing, etc…

BONUS QUALIFICATIONS

• Bachelor's and/or Master's degree in Materials Science, electrical engineering, mechanical engineering, or related field
• Experience with optical systems 
• Experience with ATE package test environment
• Experience with statistical analysis for volume production processes
• Experience in automated micro electronic and photonic assembly processes (wafer inspection, high accuracy epoxy/solder die attach, wire bonding, vision inspection, glob top/underfill dispense)
• AEC-Q100 or related automotive qualification experience

We acknowledge the confidence gap at Ouster. You do not need to meet all of these requirements to be the ideal candidate for this role.

The base pay will be dependent on your skills, work experience, location, and qualifications. This role may also be eligible for equity & benefits. ($130,000 - $200,000)

Ouster is an Equal Employment Opportunity employer that pursues and hires a diverse workforce. Ouster does not make employment decisions on the basis of race, color, religion, ethnic or national origin, nationality, sex, gender, gender-identity, sexual orientation, disability, age, military status, or any other basis protected by local, state, or federal laws. Ouster also strives for a healthy and safe workplace, and prohibits harassment of any kind. Pursuant to the San Francisco Fair Chance Ordinance, Ouster considers qualified applicants with arrest and conviction records for employment. If you have a disability or special need that requires accommodation, please let us know.